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The Elimination of Whiskers from Electroplated Tin


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This article describes two succesful approaches in eliminating whisker formation. Both methods dissipate the stress that is formed from the interaction of intermetallic compound formation and the inherent structure of electroplated tin.

As the implementation of RoHS continues to affect the industry, tin and tin alloys remain the first choice for replacing tin/lead. There is a continuous effort to come up with even better products that might lower the reflow temperature or reduce the propagation of intermetallic compounds for greater solder joint reliability and for a wider assembly window.

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