Electronics Features for February 2005

Electronics Features Archive

The Spouted Bed Electrode Plater: Improved Technology for Electroplating Micro-sized Components The Spouted Bed Electrode Plater: Improved Technology for Electroplating Micro-sized Components

The spouted bed electrode, SBE, electroplating machine was specifically designed for parts with dimensions smaller than 1 cm in any single dimension. The key technology of the SBE plater is the use of a solution jet that circulates the parts throughout the plating chamber during cleaning, activation, plating, and rinsing operations. It is particularly suitable for plating parts that are difficult to plate in traditional equipment, including surface mount passive components, flat parts, leaded components, and pins.

The Evolution of Acid Copper Plating The Evolution of Acid Copper Plating

In the North American market there are some dramatic changes in the landscape, as we see the migration of manufacturing to the Far East, particularly to China. Most of the big runners are made overseas.