Electronics Features for January 2013
In Part II of what he calls his “swan song,” industry veteran John “Jack” Horner touches on a range of subjects, from Ni electroplating from a sulfamate plating solution, to anodizing Ni, to zinc as an undercoating for Cu-Ni-Cr on steel.
23 January, 2013
In this retrospective piece, industry veteran John “Jack” Horner reflects on the early research and development and testing that spurred innovations in modern plating.
17 January, 2013
Acid copper plating has come a long way since the early days of double- and single-sided printed wiring boards. This article discusses how the North American printed circuit business continues to adjust to the every-changing landscape of global market conditions.
10 January, 2013