Editorial Features for February 2005

Editorial Features Archive

The Spouted Bed Electrode Plater: Improved Technology for Electroplating Micro-sized Components The Spouted Bed Electrode Plater: Improved Technology for Electroplating Micro-sized Components

The spouted bed electrode, SBE, electroplating machine was specifically designed for parts with dimensions smaller than 1 cm in any single dimension. The key technology of the SBE plater is the use of a solution jet that circulates the parts throughout the plating chamber during cleaning, activation, plating, and rinsing operations. It is particularly suitable for plating parts that are difficult to plate in traditional equipment, including surface mount passive components, flat parts, leaded components, and pins.