Electronics News for August 2013

Electronics News Archive

Technic's Lynn Michaelson Ph.D. to Present at the Upcoming IPC Conference on Component Technology

Dr Michaelson will be speaking on the following subjects: "Implementation of High-Speed Copper Plating," "Full Dissolution Resist Stripping" and "Selective Copper Etching for Copper Pillar Bump Fabrication."

Enthone Publishes OSP Performance Guide

Document enables OEMs, EMS, and printed circuit board fabricators to easily determine how yields, quality and reliability can be significantly increased throughout the supply chain.

U.S. Industrial Production Holds in July

Decrease in key consumer durable segments — including automotive parts production — puts drag on overall U.S. industrial output.

Winona Powder Coating Expands Etna Green, Indiana, Facility

New facility boasts updated powder coating line with a 5-stage washer, automatic and manual coating booths, and digitally controlled ovens.