Dow received the award in recognition of its successful ongoing collaborations with the semiconductor assembly and test services company related to photoresist processes and SnAg plating chemistry

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Dow Electronic Materials Receives Supplier Excellence Award from ASE

Honor is in recognition of Dow's successful collaborations with the semiconductor assembly and test services company related to photoresist processes and SnAg plating chemistry.

Dow Electronic Materials, a business unit of The Dow Chemical Company, recently announced that it is the recipient of a supplier excellence award for 2012 from ASE Group's (ASE) Kaohsiung site. Dow received the award in recognition of its successful ongoing collaborations with the semiconductor assembly and test services company related to photoresist processes and SnAg plating chemistry for advanced packaging applications. Rob Kavanagh, business director for Advanced Packaging Metallization of Dow Electronic Materials, accepted the award from Simon Li, vice president of quality assurance, ASE Kaohsiung Site, at ASE’s Best Suppliers of 2012 ceremony on March 15, 2013. 

Dow's strong track record in on-time delivery and quality control were additional factors that contributed to the company's receipt of the award.

"At Dow, we strive to deliver the industry's strongest customer support along with the most advanced packaging materials in the marketplace," said Leo Linehan, global business director for Growth Technologies of Dow Electronic Materials. "Our Advanced Packaging Technologies business continues to focus on offering materials that address the thermal, mechanical, reliability and environmental challenges in today’s advanced packaging applications, while keeping our customer’s needs and requirements as top priority. This recognition of our success in working together with ASE to develop cost-effective IC packaging solutions is a tremendous validation of our efforts.”

About Dow Electronic Materials
Dow Electronic Materials supplies materials essential for a wide range of advanced semiconductor packaging applications, including products and processes that enable the drive towards reduced form factor and increased functionality in electronic devices that require smaller and more reliable chip-to-chip and chip-to-circuit board interconnects and packages. The company’s experience in materials for front-end semiconductor manufacturing makes the company unique in the chip packaging market.

 

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Electronics  •  Industry Trends & Happenings

 

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