Technic's Lynn Michaelson Ph.D. to Present at the Upcoming IPC Conference on Component Technology

Dr Michaelson will be speaking on the following subjects: "Implementation of High-Speed Copper Plating," "Full Dissolution Resist Stripping" and "Selective Copper Etching for Copper Pillar Bump Fabrication."

Technic's senior materials scientist, Dr Lynn Michaelson, will be presenting at the upcoming IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process being held on September 10-12, 2013, in Chandler, Ariz.

To view the complete lineup of speakers, for to obtain more information on the event, please download the PDF.


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